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10GBASE-SR XENPAK Modul MM SC 300m Datenreichweite (850nm) Cisco kompatibel
Artikelnummer
TDE-XENPAK-10GB-SR
10GBASE-SR XENPAK Modul MM SC 300m Datenreichweite (850nm) Cisco kompatibel
Features
• Bis zu 10GBd bidirektionale Datenverbindungen
• Konform mit IEEE 802.3ae, 10GBASE-SR Anwendung
• Konform mit XENPAK MSA
• 850nm VCSEL Laser
• PIN Photo-Detektor
• XAUI elektrische Schnittstelle: 4 Wege bei 3.125GBd
• Unter Spannung ansteckbar
• SC Stecker
• Bis zu 300m mit MMF
• Stromversorgung 5V/3.3V/Anpassungsfähige Strom-Versorgung (APS: 1.2V)
• RoHS konform
• Betriebstemperaturbereich: 0°C bis 70°C.
Anwendungen
• 10GBd Ethernet
Parameter | Symbol | Min. | Max. | Unit | Remarks |
---|---|---|---|---|---|
Storage Ambient Temperature | TS | -40 | 85 | °C | |
Supply Voltage (3.3V) | V3 | 0 | 4 | V | |
Supply Voltage (APS) | VAPS | 0 | 1.5 | V | |
Optical Receiver Input | PIMAX | 1 | dBm | Average |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Remarks |
---|---|---|---|---|---|---|
Data Rate | DR | 10.3125 | GBD | |||
Bit Error Rate | BER | 10−12 | ||||
Total Power Consumption | P | 2.2 | W | |||
Supply Voltage (+3.3V) | VCC3 | 3.14 | 3.3 | 3.47 | V | Operating Environment |
Supply Voltage (APS) | VCCAPS | 1.152 | 1.2 | 1.248 | V | Operating Environment |
Supply Current (+3.3V) | ICC3 | 300 | mA | |||
Supply Current (APS) | ICCAPS | 1000 | mA | |||
Case Operating Temperature | TC | 0 | 70 | °C |
Parameter | Fiber Type | Modal Bandwidth at 850nm (MHz-km) | Distance Range (m) |
---|---|---|---|
10.3 GBd | 62.5/125um MMF | 160 | 2-26 |
10.3 GBd | 62.5/125um MMF | 200 | 2-33 |
10.3 GBd | 50/125um MMF | 400 | 2-66 |
10.3 GBd | 50/125um MMF | 500 | 2-82 |
10.3 GBd | 50/125um MMF | 2000 | 2-300 |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Remarks |
---|---|---|---|---|---|---|
Optical Wavelength | λ | 840 | 850 | 860 | nm | |
Launch Power | POUT | -7.3 | -1.3 | dBm | Average | |
Launch Power in OMA | POUT_OMA | -4.3 | -2.8 | dBm | ||
Launch Power of OFF Transmitter | POUT_OFF | -30 | dBm | Average | ||
Side Mode Suppression Ratio | SMSR | 30 | dB | |||
Spectral Width (RMS) | Δλ | 0.45 | nm | |||
Optical Extinction Ratio | ER | 3 | dB | |||
Optical Modulation amplitude | OMA | 525 | uW | |||
Optical Return Loss Tolerance | ORLT | 12 | dB | |||
Relative Intensity Noise | RIN | -128 | dB/Hz | |||
Transmitter Dispersion Penalty | TDP | 3.9 | dB | |||
Eye Mask Definition | According to IEEE 802.3ae and 10GBASE-SR |
Parameter | Symbol | Min. | Max. | Unit | Remarks |
---|---|---|---|---|---|
Center Wavelength Range | λC | 840 | 860 | nm | |
Optical Input Power | PIN | -9.9 | -1 | dBm | Average, Informative |
Receiver Sensitivity in OMA | PIN_OMA | -11.1 | dBm | Informative | |
Stressed Receiver Sensitivity | PIN_S | -7.5 | dBm | ||
Receiver Reflectance | TRRX | -12 | dB | ||
Receiver electrical 3dB upper cutoff frequency | FR | 12.3 | Ghz |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Remarks | |
---|---|---|---|---|---|---|---|
A. 1.2V COMS I/O DC Characteristics (PRTAD; LASI; RESET; TX_ON/OFF) | External Pull-Up Resistor For Open Drain | RPU | 10 | 22 | kΩ | ||
Output High Voltage | VOH | 1 | V | ||||
Output Low Voltage | VOL | 0.15 | V | ||||
Input High Voltage | VIH | 0.84 | 1.2 | V | |||
Input Low Voltage | VIL | 0.36 | V | ||||
Input Pull-Down Current | IPD | 20 | 120 | uA | VIN=1.2V | ||
B. XAUI I/O DC Charateristics (TXLANE[0..3]; RXLANE[0..3]) | Differential Input Amplitude (pk–pk) | VIN_XAUI | 200 | 1600 | mV | AC Coupled | |
Differential Output Amplitude (pk–pk) | VOUT_XAUI | 800 | 1600 | mV | AC Coupled | ||
C. MDIO I/O DC Charateristics (MDIO; MDC) | Output Low Voltage | VOL | 0.2 | V | IOL=100uA | ||
Output Low Current | IOL | 4 | mA | ||||
Input High Voltage | VIH | 0.84 | 1.2 | V | |||
Input Low Voltage | VIL | 0.36 | V | ||||
Pull-Up Supply Voltage | VPU | 1.2 | V | ||||
Input Capacitance | CIN | 10 | pF | ||||
Load Capacitance | CLOAD | 470 | pF | ||||
External Pull-Up Resistance | RPU | 200 | Ω |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Remarks | |
---|---|---|---|---|---|---|---|
A. XAUI Input AC Characteristics (TXLANE[0..3]) | Baud Rate | BRXAUI_IN | 3.125 | GBd | |||
Baud Rate Tolerance | BRTOL_XAUI | -100 | 100 | ppm | |||
Differential Input Impedance | ZIN_XAUI | 100 | Ω | ||||
Differential Return Loss | RLIN | 10 | dB | 100 MHz to 2.5 GHz | |||
Input Differential Skew | TIN_SKEW | 75 | ps | Crossing Point | |||
Jitter Amplitude Tolerance | JXAUI_TO | 0.65 | UIPP | IEEE 802.3ae | |||
B. XAUI Output AC Charateristics (RXLANE[0..3]) | Baud Rate | BRXAUI_OUT | 3.125 | GBd | |||
Baud Rate Variation | BRXAUI_VAR | -100 | 100 | ppm | |||
XAUI Eye Mask (far-end) | TOUT_SKEW | According to IEEE 802.3ae | |||||
Output Differential Skew | 15 | ps | |||||
Output Differential Impedance | ZOUT_XAUI | 100 | Ω | DC | |||
Differential Output Return Loss | RLOUT | 10 | dB | 100 MHz to 2.5 GHz | |||
Total Jitter | TJXAUI | UI | Near-end No pre-equalization 1 UI=320 ps |
||||
Deterministic Jitter | DJXAUI | UI | Near-end No pre-equalization 1 UI=320 ps |
||||
C. Power-On Reset Charateristics | Power-On Reset and TX_ONOFF Charateristics | According to XENPAK MSA Issue | |||||
D. MDIO I/O AC Charateristics (MDIO; MDC) | MDIO Data Hold Time | THOLD | 10 | ns | |||
MDIO Data Setup Time | TSU | 10 | ns | ||||
Delay from MDC Rising Edge to MDIO Data Change | TDELAY | 300 | ns | ||||
MDC Clock Rate | fMAX | 2.5 | MHz |
Parameter | Symbol | Min. | Max. | Unit |
---|---|---|---|---|
Temperature Monitor | TMON | -5 | +5 | °C |
Laser Bias Monitor | IMON | -10 | 10 | % |
TX Power Monitor | PTX | -3 | +3 | dBm |
RX Power Monitor | PRX | -3 | +3 | dBm |
Lieferzeit | 5-10 Werktage |
---|---|
Hersteller | tde |
Systeme | GBIC-, SFP-, XFP-, XENPAK-Transceiver |
Kategorie | XENPAK Module |
Medienobjekte |